PRESCALE
Prescale allows you to easily measure pressure distribution and range. Created using Fujifilm’s advanced thin film coating technologies, the pressure inspection sensor on the entirety of the film allows you to confirm pressure distribution of the entire surface at a glance. The colour appears red where pressure is applied, and the colour density varies according to the amount of pressure. To cover a wide pressure range (0.006 to 300 MPa), Fujifilm Prescale excellent for the applications below:
Prescale Applications:
1)Nip Pressure
Industries: Battery, Paper manufacturing, printed circuit board, electrode plate pressing, display, Rubber roller mounting quality, etc.
Adjustment of calendar roll pressure balance
Checking for wear on press rubber roller when changing paper sizes
Assessment of rubber roll mounting quality
Check for roller damage or alignment used for pressing electrode plates
2) Lamination Pressure
Industry: Printed Circuit Board(PCB), Lead frames, Liquid crystal, semiconductor production, touch panel & LCD productions, etc.
Examples of lamination pressure measurement using Prescale.
Checking adhesive pressure of dry film resist (DFR) lamination
Checking drum (roller) pressure uniformity
Verifying backgrind tape lamination pressure uniformity
Checking roller pressure uniformity when attaching the cover glass to touch panels or LCDs.
3) Winding pressure
Industry: Functional film, Paper, Coated paper, Functional paper
Stress pressure distribution during winding (paper, Film, coating)
4) Contact pressure
Checking the fitting of the brake pads of disc brakes (Automotive)
5) Compression pressure
Industry: Solar cells, Electronic components, OLEDs, Touchscreens, Print circuit boards, Equipment such as semiconductors that are used as manufacturing and development machines
Verification of pressure uniformity of vacuum heat pressure devices
Setting of vacuum laminator (Solar cells)
Checking mould contact and pressure uniformity (Laminating Machines)
Checking the water resistance of mobile phones
Ensuring high-quality thermocompression bonding by the application of uniform pressure (Bonding equipment, silicon wafer)
Checking uniformity of cell lamination load distribution (Fuel cell manufacturing)
6) Contact conditions
Check pressure uniformity between the polisher stage (Semiconductor)
Analysis of blade pressure when uneven coating thickness occurs (Film)
Verifying CMP polishing head contact uniformity (Semiconductor)
Equipment maintenance on Heat Sealing (Packaging)
Verifying CMP polishing head contact uniformity (Semiconductor)
Adjustment of molds and injection molding machines (Injection moulding)
Prescale for High Temperature (180°C to 220°C ) LLW. Pressure measurement film for use under high-temperature conditions. Measure pressure in cases where heat and pressure are applied simultaneously with ease.